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| M22XDL-350 |
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| M22XDL-460 |
L22XDL-350 |
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A design with the most advanced technology, performance and function |
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Equipped with telecentrick lens*1 |
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Different view of images caused by a variety height of parts is reduced in order |
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to inspect more accurately. |
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Available up to 40mm form PCB*2 |
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Secures a sufficient camera space to correspond to a variety of PCBs. |
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USB interface is adopted in order to connect directly to PC. |
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 Zoom in mode |
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| Model 22X does not need |
| troublesome adjustments. |
| For example, by zoom in |
| mode, inspection such as |
| 10 magnifications for IC |
| letters and 20 |
| magnifications for minute |
| chips are availablewithout |
| waiting for zoom in/out. |
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 Camera special setting |
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| In this setting, use a function to become easy to see part- by-part |
| for stable judgment, for example, black component on the |
| black surface, or bright components ona whitish surface. |
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| Automatic calibration |
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| Brightness and white balance can be automatically |
| adjusted with only one button. |
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| Parts inspection |
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| It detects missing and offset of components, polarity and |
| wrong parts at high speed with pattern matching by the |
| color image. |
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| Solder print inspection |
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| Solder print inspection is a function to inspect the status |
| of solder printed surface by examining its area, place and |
| form. |
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| Solder fillets inspection |
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| Red LED is used to inspect solder fillet, emphasizes the |
| slanting fillet and extracts its shape. Good or NG |
| judgment by pattern matching is used for the stable fillet- |
| shaped parts, and the wave method is used for judging a |
| slight amount of fillets like QFP/SOP. |
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