| BGA 3D Inspection System |
| Name:F1-3500 |
Product Detail |
| Item |
Specifications |
| Diameter |
!¢X |
| Pitch |
!¢X |
| X. Y Error |
!¢X |
| Quality |
!¢X |
| Missing Ball |
!¢X |
| Coplanality |
!¢X |
| BOARD |
!¢X |
| Mark Inspection |
!¢X |
| Lead |
!¢X |
| Light Source |
Ring Light, Vertical Light |
| Operate System |
Windows NT |
| Computer |
IPC |
| Applicable Pruducts |
BGA, QFP |
| Solder Ball |
0.3 ~ 0.76 |
| Product Appearance |
7 x 7 ~ 40 x 40 |
| Tray |
20 |
| UPH |
5000(27*27), 7000(10*10) |
| CCD |
SCANNER Capability of 3D Inspection for various products High-speed and High-accuracy 3D Inspection |
| Volt & Hertz |
AC 220V 1¢Gr 50/60Hz |
| Current |
16A |
| Air |
5 ~ 7 kg/cm2 |
|
|
|
| Open/Short Test Handler |
| Name:OS-7300 |
Product Detail |
Specifications |
| Capability for a ball pitch below 1.0!¢X |
| Automatic separation by kinds of defect. |
| Avhieve high-speed test with BGA WIRE BONDER. |
| Resistance |
1¢G[ ~ 40M¢G[ |
| Capacitance |
1pF ~ 400 ¢GgF |
| Inductance |
1¢GgH ~ 40H |
| Function Test |
| 0V ~ 100V |
| Operate System |
Windows NT |
| Computer |
IPC |
| Applicable Pruducts |
BGA |
| Solder Ball |
0.3 ~ 0.76 |
| Product Appearance |
27 x 27 ~ 40 x 40 |
| Magazing |
4 |
| UPH |
1200(27*27) |
| Automatical analysis of testing probes to see if they are damaged. |
| The number of re-test is programmable. |
| Testing height is programmable. |
| Volt & Hertz |
AC 220V 1¢Gr 50/60Hz |
| Current |
15A |
| Air |
5 ~ 7 kg/cm2 |
|
|
|
|