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| GLUE |
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 High adhesion strength prevent from falling off the chip component in
soldering process. |
| Epoxy resin used in this product keeps high insulation resistance. |
| Excellent application property due to appropriate rheology. |
| Most suitable for Dispenser application. |
Standard curing conditions are 130oC - 60 second. Since curing, however, vary
with curing system(far infrared, circulating heat oven and etc.) |
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